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All SEMIKRON products do not contain Mercury, Cadmium, Hexavalent Chromium, PBB or PBDE according to RoHS directive.
SEMIKRON is changing all products to lead-free according to RoHS. |
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Simulation tool for circuit calculation, temperature curves and the selection of power semiconductors, drivers and systems under a given nominal operating condition and heat sink temperature |
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Fast product search with the new Product Search Engine
Targeted product search according to
- current & voltage
- circuit & housing
- Type (e.g. SKKT )
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Magna Electronics and SEMIKRON form a joint venture for electric and hybrid vehicles
Sailauf / Nuremberg, Germany, June 22nd, 2009 - Magna Electronics, an operating unit of Magna International Inc. that delivers innovative electronic solutions to the automotive market, and Semikron, ... |
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Power pack now offers 33% increase in power density
100% solder-free IGBT half-bridges.
Sintered chips for higher operating temperatures and extended service life.
400kW to 1.8 MW applications |
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Driver – proven control platform for IGBT modules and systems
SEMIKRON is the first manufacturer to introduce a multi-functional control platform for IGBT modules and systems. The digital driver SKYPER 52, which has already proven to be a success in driving IGBT modules, is also being used in SEMIKRON systems. |
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Unique burn-in tests for IPM’s
SKiiP Intelligent Power Modules are now even more reliable with unique burn-in tests under worst case real inverter conditions. |
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Fuji Electric and Semikron Team Up
Two global players combine their strengths to offer power electronic components for the industrial drives market. |
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IGBT Power Modules for 3-level UPS inverters
SEMIKRON introduces a new topology to the current SEMITOP® IGBT product range now also for 3-level inverters. The topology integrates IGBT technology with lower switching and conduction losses which show 60% less losses compared to 2-level inverters. |
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First Intelligent Power Module for solder-free assembly
Semikron introduces an intelligent power module for quick and easy solder-free assembly. The Miniskiip® IPM is developed for motor power up to 15kW and has a latch-up free SOI driver IC for reliable driving already integrated. |
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Drivers go digital
The new digital driver SKYPER® 52 offers individual control parameter settings and controls parallel connected IGBTs with a total current of up to 9,000 A. |
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Less solder joints ensure improved reliability
Invented by Semikron more than three decades ago, Semipack, the first ever insulated power module is now into its 6th generation. |
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